
Project DanCap
Today’s power-electronic systems demand components that are smaller, lighter, more efficient, and capable of operating at increasingly high switching frequencies. The DanCap project is developing a new high-voltage aluminum-polymer capacitor technology aimed at addressing these challenges.
1800 hours
Lifetime tested
HV-Polymer Technology:Low-CostRecyclableLightweightReliableCoolable
1 in 3
power electronic failures is caused by a capacitor
105 °C
max operational temperature
450 V
operational voltage
(800V model cooming soon)
15 A @ 20 kHz
tested ripple current
by 38°C Case temperature
From Research to Commercialization
DanCap is currently a technology commercialization project focused on bringing a new generation of high-voltage aluminum-polymer capacitors from research into industrial applications.
The technology originates from research and development within power electronics and capacitor technology and is currently undergoing further prototype development, validation and industrialization.
The objective is to establish DanCap as an independent company in Q1 2027, followed by the continued development and commercialization of the technology together with industrial partners.
Why DanCap?
Power electronics are becoming smaller, faster and more power-dense. Capacitors increasingly become a limiting component.
Aluminum Electrolytic
DanCap HV-Polymer
Film Capacitor
Qualitative technology comparison. DanCap values represent development targets and may vary depending on application and design.
Collaborate with DanCap
DanCap is currently moving from research and prototype development toward industrial validation and commercialization. We are looking for industry partners interested in evaluating the technology, exploring potential applications, and contributing to the next stage of development.
Whether you are a power-electronics manufacturer, potential pilot customer, technology partner, supplier, or investor, we welcome opportunities to explore how DanCap’s HV-polymer capacitor technology could address future challenges in your application.
Interested in collaborating? Let’s start a conversation.
